TLMI to Sponsor PIA’s Print & Packaging Legislative Summit: June 19-20, 2018 in Washington DC
April 5, 2018 (Milford, OH):
TLMI announces that the association will be sponsoring the upcoming Print & Packaging Legislative Summit which will be held in Washington DC, June 19-20, 2018. A Printing Industries of the Americas (PIA) hosted event, the two-day Summit is an annual forum that will bring together printers/converters, industry suppliers and allied interests to present and discuss challenges relevant to the day-to-day businesses of all TLMI members including tax laws, workforce development, trade and tariff impacts, regulatory and compliance issues and recycling.
The Summit offers attendees a unique public policy and political education experience, in addition to networking opportunities with converters and industry suppliers across the entire printed packaging supply chain. The Summit will also include meetings on Capitol Hill and will offer attendees the opportunity to advocate for critical issues and legislation that directly impacts our industry.
Dan Muenzer, TLMI President, comments, “TLMI is honored to be an association sponsor at the Print & Packaging Legislative Summit. We will be joining some of our other industry sister associations in supporting this important forum, creating a collaborative and collective voice from which we can advocate for our industry on Capitol Hill. Working more collaboratively with external associations is one of the central goals of TLMI’s Strategic Plan and I look forward to representing our association at the Summit along with TLMI’s Director of Environmental Strategies and Outreach, Rosalyn Bandy.”
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